High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication
Flexible substrates with high heat resistance and low loss that support high-speed communication.
In the 5G communication industry, components with excellent high-frequency characteristics are required to achieve high-speed data transmission. It is particularly important to minimize signal transmission loss and ensure stable communication quality. Conventional substrates may face challenges with losses in the high-frequency range. Our high-heat-resistant, low-loss all-LCP flexible substrates utilize low dielectric constant materials to reduce losses of high-frequency signals, contributing to the acceleration of 5G communication. 【Application Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Stabilization of high-speed data communication - Reduction of signal loss - Improvement of communication quality
- Company：山下マテリアル
- Price：Other
